TAEO-A thermal aware & energy optimized routing protocol for wireless body area networks

Javed, Mohsin, Ahmed, Ghufran ORCID logoORCID: https://orcid.org/0000-0002-0077-9638, Mahmood, Danish ORCID logoORCID: https://orcid.org/0000-0002-2511-6638, Raza, Mohsin ORCID logoORCID: https://orcid.org/0000-0002-7351-9749, Ali, Kamran ORCID logoORCID: https://orcid.org/0000-0001-5301-9125 and Ur-Rehman, Masood (2019) TAEO-A thermal aware & energy optimized routing protocol for wireless body area networks. Sensors, 19 (15) , 3275. pp. 1-14. ISSN 1424-8220 [Article] (doi:10.3390/s19153275)

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Wireless Body Area Networks (WBANs) are in the spotlight of researchers and engineering industries due to many applications. Remote health monitoring for general as well as military purposes where tiny sensors are attached or implanted inside the skin of the body to sense the required attribute is particularly prominent. To seamlessly accomplish this procedure, there are various challenges, out of which temperature control to reduce thermal effects and optimum power consumption to reduce energy wastage are placed at the highest priority. Regular and consistent operation of a sensor node for a long-time result in a rising of the temperature of respective tissues, where it is attached or implanted. This temperature rise has harmful effects on human tissues, which may lead to the tissue damage. In this paper, a Temperate Aware and Energy Optimized (TAEO) routing protocol is proposed that not only deals with the thermal aspects and hot spot problem, but also extends the stability and lifetime of a network. Analytical simulations are conducted, and the results depict better performance in terms of the network lifetime, throughput, energy preservation, and temperature control with respect to state of the art WBAN protocols.

Item Type: Article
Additional Information: This article belongs to the Special Issue Smart, Secure and Sustainable (3S) Technologies for IoT Based Healthcare Applications
Keywords (uncontrolled): energy efficient, hot spot, power dissipation, thermal aware, WBAN
Research Areas: A. > School of Science and Technology > Computer and Communications Engineering
Item ID: 27247
Notes on copyright: © 2019 by the authors. Licensee MDPI, Basel, Switzerland. This article is an open access article distributed under the terms and conditions of the Creative Commons Attribution (CC BY) license (http://creativecommons.org/licenses/by/4.0/).
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Depositing User: Jisc Publications Router
Date Deposited: 29 Jul 2019 08:09
Last Modified: 29 Nov 2022 18:57
URI: https://eprints.mdx.ac.uk/id/eprint/27247

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